Business Area

Global Leader in Ultra Precision Processing
Providing an integrated process service from precision machining to polishing finishing

Business Technology

Polishing Division

Lapping & Polishing

PIG
MEMS: max12” / Sapphire – 2”~8”
Ceramic, Qurtz – Max Ø1,500㎜
SIC Wafer & Precision parts
MEMS / OLED / Lens / Medical Equipment
Lapping / Polishing / Mirror Finishing / CMP
- - Future: Defense, Aerospace, Proprietary Brand Products

Polishing Technology Services

Large area polishing

Φ1000

Quartz: Parallelism 0.01

Φ618×618×T10

Alumina: Parallelism 0.01

Φ600

Titanium G2 Roller

CERAMIC HOLDER

* Please slide for more details.

Material	Measurement	Appearance	Normal
Al2O3 - 99.7%	Spec	Crack	Diameter
	Flatness 2um	None	Ø360±0.12
	Interferometer	Damage	Thickness
	Measure	None	15.0 +0.2/-0.0
	Φ300 Stitching	Cleaning	Corner R 3.0
			Packing
			Individually
			packaged
			P-box/PE-form

CERAMIC HOLDER

* Please slide for more details.

Material	Measurement	Appearance	Normal
Al2O3 - 99.7%	Spec	Crack	Diameter
	Flatness 2um	None	Ø485±0.12
	Interferometer	Damage	Thickness
	Measure	None	16.0 +0.2/-0.0
	Φ300 Stitching	Cleaning	Corner R 2.0
			Packing
			Individually
			packaged
			P-box/PE-form

Laser interferometer measurement – flatness

Using a 300mm laser interferometer

Large area measurement using stitching method

0.3㎛ flatness

Φ360 area polishing and stitching measurement results

Φ360㎜ ceramic plate